Polyamide 4.6 TW 441

PROPERTYTEST METHODUNITTYPICAL VALUE
Molding shrinkage (parallel)ISO 294-4%2 / *
Molding shrinkage (normal)ISO 294-4%2 / *
Tensile modulusISO 527-1/-2 MPa3300
Tensile modulus (120°C)ISO 527-1/-2 MPa800
Tensile modulus (160°C)ISO 527-1/-2 MPa650
Tensile modulus (180°C)ISO 527-1/-2 MPa600
Tensile modulus (200°C)ISO 527-1/-2 MPa500
Yield stressISO 527-1/-2 MPa100 / 55
Yield stress(120°C)ISO 527-1/-2 MPa50
Yield stress(160°C)ISO 527-1/-2 MPa40
Yield stress(180°C)ISO 527-1/-2 MPa35
Yield stress(200°C)ISO 527-1/-2 MPa30
Nominal strain at break ISO 527-1/-2 %40/ >50
Nominal strain at break(120°C)ISO 527-1/-2 %>50
Nominal strain at break(160°C)ISO 527-1/-2 %>50
Nominal strain at break(180°C)ISO 527-1/-2 %>50
Nominal strain at break(200°C)ISO 527-1/-2 %>50
Flexural modulusISO 178MPa3000 / 900
Flexural modulus(120°C) ISO 178MPa800
Flexural modulus(160°C)ISO 178MPa600
Charpy impact strength (+23°C)ISO 179/1eUkJ/m2N/N
Charpy impact strength (-30°C)ISO 179/1eUkJ/m2N/N
Charpy notched impact strength (+23°C)ISO 179/1eUkJ/m212/45
Izod notched impact strength (+23°C)ISO 180/1AkJ/m210/40
Melting temperature (10°C/min)ISO 11357-1/-3°C295 / *
Temp. of deflection under load (1.80 MPa)ISO 75-1/-2°C190 / *
Temp. of deflection under load (0.45 MPa)ISO 75-1/-2°C280/*
Coeff. of linear therm. expansion (parallel)ISO 11359-1/-2E-4/°C0.85/ *
Coeff. of linear therm. expansion (normal)ISO 11359-1/-2E-4/°C1.1 / *
Thermal Index 5000 hrsIEC 60216/ISO 527-1/-2°C152
Volume resistivityIEC 60093Ohm*m1E13 / 1E7
Electric strengthIEC 60243-1kV/mm 25/15
Comparative tracking indexIEC 60112-400 /-
Relative permittivity (100Hz)IEC 60250 -3.9/22
Relative permittivity (1 MHz)IEC 60250-3.6/4.5
Humidity absorptionSim. to ISO 62%3.7/ *
DensityISO 1183kg/m31180 / -