Technical Datasheet PC 3113

PROPERTYTEST METHODUNITTYPICAL VALUE
Melt volume-flow rate, MVRISO 1133cm3/10min6
TemperatureISO 1133ºC300
LoadISO 1133kg1.2
Molding shrinkage, parallelISO 294-4,2577%0.7
Molding shrinkage, normalISO 294-4,2577%0.8
Tensile ModulusISO 527-1/-2MPa2350
Yield stressISO 527-1/-2MPa65
Yield strainISO 527-1/-2%6.3
Nominal strain at breakISO 527-1/-2%>50
Tensile creep modulus, 1hISO 899-1MPa2200
Tensile creep modulus, 1000hISO 899-1MPa1900
Charpy impact strength, +23ºCISO 179/1eUkJ/m2N
Charpy impact strength, -30ºCISO 179/1eUkJ/m2N
Puncture- maximum force, +23ºCISO 6603-2N5600
Puncture- maximum force, -30ºCISO 6603-2N6500
Puncture- energy, +23ºCISO 6603-2J60
Puncture- energy, -30ºCISO 6603-2J70
Glass transition temperature,10 ºC/minISO 11357-1/-2ºC148
Temp. of deflection under load, 1.80 MPaISO 75-1/-2ºC128
Temp. of deflection under load, 0.45 MPaISO 75-1/-2ºC141
Vicat softening temperature, 50 ºC/h 50NISO 306ºC148
Coeff. Of liner therm. Expansion, parallelqISO 11359-1/-2E-6/K65
Coeff. Of liner therm. Expansion, normalISO 11359-1/-2E-6/K65
Burning Behav. at 1.5 mm nom. thicknIEC 60695-11-10ClassHB
Thickness testedIEC 60695-11-10mm1.5
UL recognition--UL
Burning Behav, at thickness hIEC 60695-11-10ClassV-2
Thickness testedIEC 60695-11-10mm0.8
UL recognition--UL
Oxygen indexISO 4589-1/-2%28
Relative permittivity, 100HzIEC 60250-3.1
Relative permittivity, 1MHzIEC 60250-3
Dissipation factor, 100HzIEC 60250E-48
Dissipation factor, 1MHzIEC 60250E-4100
Volume resistivityIEC 60093Ohm*m>1E13
Surface resistivityIEC 60093Ohm>1E15
Electric strengthIEC 60243-1kV/mm34
Comparative tracking indexIEC 60112-250
Water absorptionSim. To ISO62%0.3
Humidity absorptionSim. To ISO62%0.12
Density of melt-%89
Injection molding, melt temperatureISO 294ºC300
Injection molding, mold temperatureISO 10724ºC80
Injection molding, injection velocityISO 294mm/s200