Technical Datasheet PC 9415

PROPERTYTEST METHODUNITTYPICAL VALUE
Melt volume-flow rate, MVR@300 ºC, 1.2kgISO 1133cm3/10min6
Molding shrinkage, parallelISO 294-4,2577%0.6
Molding shrinkage, normalISO 294-4,2577%0.5
Tensile ModulusISO 527-1/-2MPa3800
Stress at breakISO 527-1/-2MPa45
Strain at breakISO 527-1/-2%15
Tensile creep modulus, 1hISO 899-1MPa3600
Tensile creep modulus, 1000hISO 899-1MPa2900
Puncture- maximum force, +23ºCISO 6603-2N4000
Puncture- maximum force, -30ºCISO 6603-2Nv3700
Puncture- energy, +23ºCISO 6603-2J25
Puncture- energy, -30ºCISO 6603-2J15
Temp. of deflection under load, 1.80 MPaISO 75-1/-2ºC136
Temp. of deflection under load, 0.45 MPaISO 75-1/-2ºC142
Vicat softening temperature, 50 ºC/h 50NISO 306ºC145
Coeff. Of liner therm. Expansion, parallelISO 11359-1/-2E-6/K40
Coeff. Of liner therm. Expansion, normalISO 11359-1/-2E-6/K65
Burning Behav. at 1.5 mm nom. Thickn.IEC 60695-11-10ClassV-0
Thickness testedIEC 60695-11-10mm1.5
UL recognition--UL
Burning Behav, at thickness hIEC 60695-11-10ClassV-2
Thickness testedIEC 60695-11-10mm0.8
UL recognition--UL
Burning Behav, at thickness hIEC 60695-11-20Class5VA
Thickness testedIEC 60695-11-20mm3.0
UL recognition--UL
Oxygen indexISO 4589-1/-2%35
Relative permittivity, 100HzIEC 60250-3.2
Relative permittivity, 1MHzIEC 60250-3.2
Dissipation factor, 100HzIEC 60250E-410
Dissipation factor, 1MHzIEC 60250E-490
Volume resistivityIEC 60093Ohm*m>1E13
Surface resistivityIEC 60093Ohm>1E15
Electric strengthIEC 60243-1kV/mm36
Comparative tracking indexIEC 60112-175
Water absorptionSim. To ISO 62%0.26
Humidity absorptionSim. To ISO 62%0.1
DensityISO 1183Kg/m31270
Density of melt-Kg/m31080
Thermal conductivity of melt-w/(m k)0.252
Spec. heat capacity of melt-J/(kg k)2100
Eff. Thermal diffusivity-M2/s1.11E-7
Ejection temperature-ºC140
Injection Molding, melt temperatureISO 294ºC300
Injection Molding, mold temperatureISO 10724ºC110
Injection Molding, injection velocityISO 294mm/s200